Chemical Research in Chinese Universities ›› 2013, Vol. 29 ›› Issue (5): 991-997.doi: 10.1007/s40242-013-3013-y

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Electrochemical Study and Electrodeposition of Copper(I) in Ionic Liquid-reline

POPESCU Ana-Maria1, COJOCARU Anca2, DONATH Cristina1, CONSTANTIN Virgil1   

  1. 1. Laboratory of Molten Salts, "Ilie Murgulescu" Institute of Physical Chemistry of Romanian Academy, Bucharest 060021, Romania;
    2. Department of Applied Physical Chemistry and Electrochemistry, University Politehnica of Bucharest, Bucharest 010737, Romania
  • Received:2013-01-08 Revised:2013-03-05 Online:2013-10-01 Published:2013-09-17
  • Contact: CONSTANTIN Virgil E-mail:virgilconstantin@yahoo.com
  • Supported by:

    Supported by the PNCDI-2 Romanian Partnership Programmes-grant Project(No.31066/2007-2010).

Abstract:

The authors made the electrochemical studies on the electrode processes during copper electrodeposition with ionic liquids-reline as an electrolytic medium. Reline is a commercial name for a eutectic mixture of choline chloride and urea(1:2, molar ratio). This new proposed method of copper deposition is an ecological one because the ionic liquids are recyclable, non-volatile and non-toxic. Cyclic voltammetry investigations were conducted at 343 and 353 K in choline chloride-urea(Reline) deep eutectic solvent with single salt CuCl(generally in 0.05—0.38 mol/L concentration range). Electrochemical impedance spectroscopy investigations were conducted in choline chloride-urea ionic liquid with CuCl(0.05 mol/L). We investigated both cathodic and anodic processes of Cu+ ions at different sweep rates in this new electrolytic system based on choline chloride. We have proposed by this an alternative to the classical copper electrodeposition. Coefficient of diffusion, D0, for the system Reline-CuCl is presented and the value of D0 is 1.22×10-8 cm2/s.

Key words: Ionic liquid, Reline, Electrodeposition, Cu(I), Coefficient of diffusion