Oligo-fluoropolymer Modified Cycloaliphatic Epoxy Resins with Excellent Compatibility, Waterproof and Mechanical Properties for LED Encapsulation

doi:10.1007/s40242-018-7228-9

Abstract

Abstract: An oligo-fluoropolymer(PFM) with functional cycloaliphatic epoxy and fluorinated groups was obtained via free radical polymerization and applied to the modification of cycloaliphatic epoxy resins(CE). The chemical structure of PFM was characterized by Fourier transform infrared(FTIR) spectroscopy, gel permeation chromatography(GPC) and nuclear magnetic resonance(NMR) spectroscopy, and the effects of different PFM concentrations(0.5%—6%, mass fraction) on the thermal resistance, mechanical properties, surface dewettability, light transmission, refractive index and various cured polymer properties were studied in detail. The DSC and TGA results demonstrate that the modified epoxy resins possess a higher thermal resistance than the neat epoxy resin. The improvements in the surface dewettability and water resistance are caused by the high crosslinking density and the enrichment of the oligo-fluorinated random copolymers dispersed in the matrix. The fracture surface morphologies of the thermosets were investigated by scanning electron microscopy(SEM) and transmission electron microscopy(TEM). It was observed that the optical transmittance of the composites was maintained even though microphase separation occurred during the curing process. With respect to the corresponding properties of the neat epoxy resins, the 2 phr(parts per hundreds of resin) PFM thermoset exhibited relatively better comprehensive properties, making the cured material a good candidate for light-emitting diode(LED) encapsulation.

Key words: Oligo-fluoropolymer, Epoxy resin, Light-emitting diode, Encapsulate

SUN Yang, LIU Weiqu, WANG Zhengfang, TAN Jianquan. Oligo-fluoropolymer Modified Cycloaliphatic Epoxy Resins with Excellent Compatibility, Waterproof and Mechanical Properties for LED Encapsulation[J]. Chemical Research in Chinese Universities, 2018, 34(2): 326-332.

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