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高等学校化学研究 ›› 2018, Vol. 34 ›› Issue (5): 862-866.doi: 10.1007/s40242-018-7419-4

• Articles • 上一篇    

Hollow-glass-microsphere-based Biphenyl Epoxy Resin Composite with Low Dielectric Contant

XU Weiwei1, NA Hui2, ZHAO Chengji2   

  1. 1. Center of Metrology, Datang Northeast Electric Power Test & Research Institute Co., Ltd., Changchun 130012, P. R. China;
    2. College of Chemistry, Jilin University, Changchun 130012, P. R. China
  • 收稿日期:2017-12-20 修回日期:2018-05-05 出版日期:2018-10-01 发布日期:2018-09-21
  • 通讯作者: ZHAO Chengji,mail:zhaochengji@jlu.edu.cn E-mail:mail:zhaochengji@jlu.edu.cn
  • 基金资助:
    Supported by the National Natural Science Foundation of China(No.21474036).

Hollow-glass-microsphere-based Biphenyl Epoxy Resin Composite with Low Dielectric Contant

XU Weiwei1, NA Hui2, ZHAO Chengji2   

  1. 1. Center of Metrology, Datang Northeast Electric Power Test & Research Institute Co., Ltd., Changchun 130012, P. R. China;
    2. College of Chemistry, Jilin University, Changchun 130012, P. R. China
  • Received:2017-12-20 Revised:2018-05-05 Online:2018-10-01 Published:2018-09-21
  • Contact: ZHAO Chengji,mail:zhaochengji@jlu.edu.cn E-mail:mail:zhaochengji@jlu.edu.cn
  • Supported by:
    Supported by the National Natural Science Foundation of China(No.21474036).

摘要： In this study, rigid 4,4'-diglycidyl(3,3',5,5'-tetramethylbiphenyl) epoxy(TMBP)-based composites were developed by the incorporation of varying percentages of commercial hollow glass microspheres(HGMs, QH-450) into the TMBP resin used for electronic packaging. The thermal and mechanical properties as well as the morphology of all the composites were characterized, and dielectric properties were characterized by advanced analytical techniques. The results reveal that a series of TMBP/QH-450 composites exhibits higher initial degradation temperatures(Td,5%>300℃), and the residual char and glass transition temperature were clearly improved with QH-450 loading. In addition, all epoxy composites exhibited a lower dielectric constant ranging from 3.74 to 3.06 at 1.2 MHz because the lower dielectric properties of the inert gas used as the core of the QH-450 decreased molecule polarity. Hence, this developed TMBP/QH450 system demonstrates potential applications in electronic packaging.

关键词: Biphenyl, Thermal property, Polymer composite, Dielectric constant

Abstract: In this study, rigid 4,4'-diglycidyl(3,3',5,5'-tetramethylbiphenyl) epoxy(TMBP)-based composites were developed by the incorporation of varying percentages of commercial hollow glass microspheres(HGMs, QH-450) into the TMBP resin used for electronic packaging. The thermal and mechanical properties as well as the morphology of all the composites were characterized, and dielectric properties were characterized by advanced analytical techniques. The results reveal that a series of TMBP/QH-450 composites exhibits higher initial degradation temperatures(Td,5%>300℃), and the residual char and glass transition temperature were clearly improved with QH-450 loading. In addition, all epoxy composites exhibited a lower dielectric constant ranging from 3.74 to 3.06 at 1.2 MHz because the lower dielectric properties of the inert gas used as the core of the QH-450 decreased molecule polarity. Hence, this developed TMBP/QH450 system demonstrates potential applications in electronic packaging.

Key words: Biphenyl, Thermal property, Polymer composite, Dielectric constant